Pick and Place Capability
- Lora based wireless device
- 1+ KM range
- 60+% efficiency
- Compact form factor
- Antenna design, tuning and EIRP / TRP testing
- Avg. 8db EIPR and 18db EIRP
- Tested at TUV Lab
- Compact battery
BLE based Biometric security card with Display
- Secure Card:
- Size: 54x85x.75 (standard credit card)
- 2” non-volatile display
- BLE + swipe
- Battery for about 50+ swipes
- Fingerprint reader
- Wireless charging
- Swipe access (credit card)
- Production testing thru single port.
Wireless Data Acquisition (WDA)
- SOW: spec to tested boards with application front end.
- 24Bit ADC, 6 Channel 19.2K SPS
- Measure 0-1500C temp with 0.5% tolerance (thermocouple and RTD)
- Pressure Transmitter and Transducer with less than 1% accuracy (0-5V or (4-20mA)
- Tested up to 10 SPS for 4+ hours
- Data Acquisition error less than 2%
- Can Handel 5-6 sensors per module
- Ultra low power transmitted power 0.3W
- Tested 200m line-of-sight
- Wireless part can be BT, Wi-Fi or ZigBee
- Wired – Ethernet or USB
- Application:
- Temperature and Pressure and Flow sensors sensor WDA
- Medical Sensors
BLE Based Diagnostic Device
- Monitoring
- ECG
- Temperature
- Hart Rate
- Parodic / continues Monitoring
- Configurable battery life (max 15 days)
LoRa Based remote sensor
- ZigBee / BLE Based AC control.
- Senses both temperature and Humidity.
- 100+ Meters range LOS
- < 0.4 W Power consumption
- Customized Internal antenna
Compact Power board
- Power PCB design and thermal simulations.
- +50W in 70mm x 50mm PCB size
500 Ball TBGA
- SOW
- Package design : 0.8mm, 25mm x 25mm 500 Ball BGA
- low parasitic : L =<2nH, C = 0.2pF & R= <100 mOhm
- Theta-JA :16 W/C
- Achieved
- Package design : 0.8mm, 25mm x 25mm 500 Ball TBGA
- Parasitic : L = <2.2nH, C = 0.15pF & R= <1moOhm
- Theta-JA :14.5 W/C (JEDEC51 standards)
- Cavity down TBGA with multi tier wire bonding
- 60um pad pitch
- 467 Wire bonds
- 50um line and spacing
- Impedance matching
- 40um line and spacing & 75um drill
Use case-PBGA352
- SOW
- Package design : 0.8mm, 15mm x 15mm 352 BGA
- low parasitic : L = 2nH, C = 0.5pF & R= <75 mOhm
- Theta-JA :25 W/C
- Achieved
- Package design : 0.8mm, 15mm x 15mm 352 Ball TBGA
- Parasitic : L = <.2nH, C = <0.45pF & R= <50 mOhm
- Theta-JA :25 W/C (JEDEC51 standards)
- PBGA with multi tear wire bonding
- 60um pad pitch & 45 um pad
- 295 Wire bonds , Impedance matching
- Thermal Simulation – handles 2W power
- Electrical Simulation – very low parasitic
- 4 Tier wire bonding on 60 u die pad pitch
- 296 wires of 0.7 mil gold
DV TEST BENCH (RAILWAYS)
- SOW:
- Design and testing of Hardware
- Firmware development
- Application Software development
